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Amaoe BGA reballing stencil For HI1101 HI1102 HI1103 HI6361 HI6401 HI6353 HI6363 HI6362 HI6402 HI6403 WiFi IC Chip Tin Plant Net
$6.86
18% Off
200 in stock
Description
Product Introduction：
Amaoe BGA reballing stencil ForHI1101 HI1102 HI1103 HI6361 HI6401 HI6353 HI6363 HI6362 HI6402 HI6403 WiFi IC Chip Tin Plant Net
Package:
1 x Rebaling Stencil Template
Additional information
| Type | Other |
|---|---|
| Model Number | Amaoe BGA Reballing Stencil |
| is_customized | No |
| Material | Stainless Steel |
| Usage | Commercial Manufacture |
| Thickness | 0.12MM |
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