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Home/Repair Tools/BGA Reballing Stencil/AMAOE BGA Reballing Stencil/Amaoe BGA Reballing Stencil FOR Qualcomm Audio WIFI IC WCD9330 WCD9341 WCD9340 WCD9335 WCN3660 WCN3680 Chip BGA IC Reballing Tin
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Amaoe BGA Reballing Stencil FOR Qualcomm Audio WIFI IC WCD9330 WCD9341 WCD9340 WCD9335 WCN3660 WCN3680 Chip BGA IC Reballing Tin

$7.70 $6.39

17% Off

199 in stock

Description

Product Introduction:

Amaoe BGA Reballing Stencil FOR Qualcomm Audio WIFI IC WCD9330 WCD9341 WCD9340 WCD9335 WCD9326 WCD9304 WCD9302 WCD9306 WCD9310 WCD9320 WCN3660 WCN3660B WCN3680 WCN3680B WCN3620 WCN3980 WCN3990 WCN3610 WCN3615 Chip BGA IC Reballing Tin

Package:

1 x Rebaling Stencil Template

Additional information

Type

Other

Model Number

Amaoe BGA Reballing Stencil

is_customized

No

Material

Stainless Steel

Usage

Commercial Manufacture

Thickness

0.12MM

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