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Amaoe BGA Reballing Stencil FOR Qualcomm Baseband QSC6270 1110 1105 MDM9600 6600 8215 MSM6260 6246 7521 Chip cpu Reballing Tin
$6.86
18% Off
200 in stock
Description
Product Introduction：
Amaoe BGA Reballing Stencil FOR Qualcomm Baseband QSC6270 QSC1110 QSC1105 MDM9600 MDM6600 MDM8215 MSM6260 MSM6246 MSM9215M MSM7227 MSM8909W MSM7521 Chip cpu BGA IC Reballing Tin
Package:
1 x Rebaling Stencil Template
Additional information
| Type | Other |
|---|---|
| Model Number | Amaoe BGA Reballing Stencil |
| is_customized | No |
| Material | Stainless Steel |
| Usage | Commercial Manufacture |
| Thickness | 0.12MM |
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