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Home/Repair Tools/BGA Reballing Stencil/AMAOE BGA Reballing Stencil/Amaoe BGA Reballing Stencil FOR Qualcomm Baseband QSC6270 1110 1105 MDM9600 6600 8215 MSM6260 6246 7521 Chip cpu Reballing Tin
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Amaoe BGA Reballing Stencil FOR Qualcomm Baseband QSC6270 1110 1105 MDM9600 6600 8215 MSM6260 6246 7521 Chip cpu Reballing Tin

$8.57 $6.94

19% Off

200 in stock

Description

Product Introduction:

Amaoe BGA Reballing Stencil FOR Qualcomm Baseband QSC6270 QSC1110 QSC1105 MDM9600 MDM6600 MDM8215 MSM6260 MSM6246 MSM9215M MSM7227 MSM8909W MSM7521 Chip cpu BGA IC Reballing Tin

Package:

1 x Rebaling Stencil Template

Additional information

Type

Other

Model Number

Amaoe BGA Reballing Stencil

is_customized

No

Material

Stainless Steel

Usage

Commercial Manufacture

Thickness

0.12MM

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