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Amaoe BGA Reballing Stencil FOR Qualcomm Baseband QSC6270 1110 1105 MDM9600 6600 8215 MSM6260 6246 7521 Chip cpu Reballing Tin
$6.86
18% Off
200 in stock

Description
Product Introduction:
Amaoe BGA Reballing Stencil FOR Qualcomm Baseband QSC6270 QSC1110 QSC1105 MDM9600 MDM6600 MDM8215 MSM6260 MSM6246 MSM9215M MSM7227 MSM8909W MSM7521 Chip cpu BGA IC Reballing Tin
Package:
1 x Rebaling Stencil Template
Additional information
Type | Other |
---|---|
Model Number | Amaoe BGA Reballing Stencil |
is_customized | No |
Material | Stainless Steel |
Usage | Commercial Manufacture |
Thickness | 0.12MM |
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