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Home/Repair Tools/BGA Reballing Stencil/AMAOE BGA Reballing Stencil/Amaoe BGA Reballing Stencil FOR Qualcomm intermediate frequency IC WFR1620 WTR1625/L 3905 1605/L 5975 2605 Chip Reballing Tin
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Amaoe BGA Reballing Stencil FOR Qualcomm intermediate frequency IC WFR1620 WTR1625/L 3905 1605/L 5975 2605 Chip Reballing Tin

$7.70 $6.39

17% Off

200 in stock

Description

Product Introduction:

Amaoe BGA Reballing Stencil FOR Qualcomm intermediate frequency IC WFR1620 WTR1625/L WTR3905/3925 WFR2600 WTR4905/4605 WTR1605/L WTR5975 WTR2605/2100 WTR2955/2965 Chip Reballing Tin

Package:

1 x Rebaling Stencil Template

Additional information

Type

Other

Model Number

Amaoe BGA Reballing Stencil

is_customized

No

Material

Stainless Steel

Usage

Commercial Manufacture

Thickness

0.12MM

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