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Amaoe BGA Reballing Stencil FOR Qualcomm MT6779V MT6768V MT6758V MT6761V MT6165V SDM439 MSM8909W CPU Chip BGA IC Reballing Tin
$6.86
18% Off
176 in stock

Description
Product Introduction:
Amaoe BGA Reballing Stencil FOR Qualcomm MT6779V MT6768V MT6758V MT6761V MT6165V SDM439 MSM8909W CPU Chip BGA IC Reballing Tin
Package:
1 x Rebaling Stencil Template
Additional information
Type | Other |
---|---|
Model Number | Amaoe BGA Reballing Stencil |
is_customized | No |
Material | Stainless Steel |
Usage | Commercial Manufacture |
Thickness | 0.12MM |
5 reviews for Amaoe BGA Reballing Stencil FOR Qualcomm MT6779V MT6768V MT6758V MT6761V MT6165V SDM439 MSM8909W CPU Chip BGA IC Reballing Tin
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