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Home/Repair Tools/BGA Reballing Stencil/AMAOE BGA Reballing Stencil/Amaoe BGA Reballing Stencil FOR Qualcomm PM660 670 845 MT6358W 6356W 6355W 6357V 6370P Power PMIC Chip BGA IC Reballing Tin
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(3 customer reviews)

Amaoe BGA Reballing Stencil FOR Qualcomm PM660 670 845 MT6358W 6356W 6355W 6357V 6370P Power PMIC Chip BGA IC Reballing Tin

$11.27 $9.13

19% Off

191 in stock

Description

Product Introduction:

Amaoe BGA Reballing Stencil FOR Qualcomm PM660 670 845 MT6358W 6356W 6355W 6357V 6370P Power PMIC Chip BGA IC Reballing Tin

Package:

1 x Rebaling Stencil Template

Additional information

Type

Other

Model Number

Amaoe BGA Reballing Stencil

is_customized

No

Material

Stainless Steel

Usage

Commercial Manufacture

Thickness

0.12MM

3 reviews for Amaoe BGA Reballing Stencil FOR Qualcomm PM660 670 845 MT6358W 6356W 6355W 6357V 6370P Power PMIC Chip BGA IC Reballing Tin

  1. A***n

  2. v***a

  3. E***s

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