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Amaoe BGA Reballing Stencil FOR Qualcomm PM660 670 845 MT6358W 6356W 6355W 6357V 6370P Power PMIC Chip BGA IC Reballing Tin
$8.76
18% Off
190 in stock
Description
Product Introduction：
Amaoe BGA Reballing Stencil FOR Qualcomm PM660 670 845 MT6358W 6356W 6355W 6357V 6370P Power PMIC Chip BGA IC Reballing Tin
Package:
1 x Rebaling Stencil Template
Additional information
| Type | Other |
|---|---|
| Model Number | Amaoe BGA Reballing Stencil |
| is_customized | No |
| Material | Stainless Steel |
| Usage | Commercial Manufacture |
| Thickness | 0.12MM |
3 reviews for Amaoe BGA Reballing Stencil FOR Qualcomm PM660 670 845 MT6358W 6356W 6355W 6357V 6370P Power PMIC Chip BGA IC Reballing Tin
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