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Home/Repair Tools/BGA Reballing Stencil/AMAOE BGA Reballing Stencil/Amaoe BGA Reballing Stencil FOR Qualcomm SDM710 SDM845 SDM660 SDM636 MTK MT6771V MT6739V MT6763V MT6757V CPU Reballing Tin
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(2 customer reviews)

Amaoe BGA Reballing Stencil FOR Qualcomm SDM710 SDM845 SDM660 SDM636 MTK MT6771V MT6739V MT6763V MT6757V CPU Reballing Tin

$7.70 $6.39

17% Off

198 in stock

Description

Product Introduction:

Amaoe BGA Reballing Stencil FOR Qualcomm SDM710 SDM845 SDM660 SDM636 MTK MT6771V MT6739V MT6763V MT6757V CPU Reballing Tin

Package:

1 x Rebaling Stencil Template

Additional information

Type

Other

Model Number

Amaoe BGA Reballing Stencil

is_customized

No

Material

Stainless Steel

Usage

Commercial Manufacture

Thickness

0.12MM

2 reviews for Amaoe BGA Reballing Stencil FOR Qualcomm SDM710 SDM845 SDM660 SDM636 MTK MT6771V MT6739V MT6763V MT6757V CPU Reballing Tin

  1. J***a

  2. XiDiGi Shopper

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