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Home/Repair Tools/BGA Reballing Stencil/AMAOE BGA Reballing Stencil/Amaoe BGA reballing stencil For REDMI K20 K20Pro XIAOMI 9 Qualcomm Snapdragon 730 sm7150 855 SM8150 CPU Chip BGA Tin Plant Net
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(5 customer reviews)

Amaoe BGA reballing stencil For REDMI K20 K20Pro XIAOMI 9 Qualcomm Snapdragon 730 sm7150 855 SM8150 CPU Chip BGA Tin Plant Net

$8.57 $6.94

19% Off

187 in stock

Description

Product Introduction:

Amaoe BGA reballing stencil For REDMI K20 K20Pro XIAOMI 9 Qualcomm Snapdragon 730 sm7150 855 SM8150 CPU Chip BGA Tin Plant Net

Package:

1 x Rebaling Stencil Template

Additional information

Type

Other

Model Number

Amaoe BGA Reballing Stencil

is_customized

No

Material

Stainless Steel

Usage

Commercial Manufacture

Thickness

0.12MM

5 reviews for Amaoe BGA reballing stencil For REDMI K20 K20Pro XIAOMI 9 Qualcomm Snapdragon 730 sm7150 855 SM8150 CPU Chip BGA Tin Plant Net

  1. V***v

  2. T***i

  3. E***i

    ok

  4. E***v

  5. R***z

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