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Amaoe BGA reballing stencil For REDMI K20 K20Pro XIAOMI 9 Qualcomm Snapdragon 730 sm7150 855 SM8150 CPU Chip BGA Tin Plant Net
$6.86
18% Off
155 in stock
Description
Product Introduction：
Amaoe BGA reballing stencil For REDMI K20 K20Pro XIAOMI 9 Qualcomm Snapdragon 730 sm7150 855 SM8150 CPU Chip BGA Tin Plant Net
Package:
1 x Rebaling Stencil Template
Additional information
| Type | Other |
|---|---|
| Model Number | Amaoe BGA Reballing Stencil |
| is_customized | No |
| Material | Stainless Steel |
| Usage | Commercial Manufacture |
| Thickness | 0.12MM |
5 reviews for Amaoe BGA reballing stencil For REDMI K20 K20Pro XIAOMI 9 Qualcomm Snapdragon 730 sm7150 855 SM8150 CPU Chip BGA Tin Plant Net
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