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Home/Repair Tools/BGA Reballing Stencil/AMAOE BGA Reballing Stencil/Amaoe BGA Reballing Stencil For SAMSUNG A520 A310 S5mini Exynos 7880 7580 3470 A5 A3 A7 J7 S5 CPU Chip BGA Stencil IC Solder Tin
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(7 customer reviews)

Amaoe BGA Reballing Stencil For SAMSUNG A520 A310 S5mini Exynos 7880 7580 3470 A5 A3 A7 J7 S5 CPU Chip BGA Stencil IC Solder Tin

$7.70 $6.39

17% Off

184 in stock

Description

Product Introduction:

Amaoe BGA Reballing Stencil For SAMSUNG A520 A310 S5mini Exynos 7880 7580 3470 A5 A3 A7 J7 S5 CPU Chip BGA Stencil IC Solder Tin

Package:

1 x Rebaling Stencil Template

Additional information

Type

Other

Model Number

Amaoe BGA Reballing Stencil

is_customized

No

Material

Stainless Steel

Usage

Commercial Manufacture

Thickness

0.12MM

7 reviews for Amaoe BGA Reballing Stencil For SAMSUNG A520 A310 S5mini Exynos 7880 7580 3470 A5 A3 A7 J7 S5 CPU Chip BGA Stencil IC Solder Tin

  1. A***a

  2. D***n

    Заебачие трафареты

  3. R***a

  4. G***T

  5. S***n

    доставка около месяца. брал за 374. сделано хорошо.

  6. D***k

  7. A***i

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