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Amaoe BGA Reballing Stencil For SAMSUNG Exynos 8895 MSM8998 S8 S8+ NOTE8 G9500 G955U N9500 CPU Chip BGA Stencil IC Solder Tin
$6.86
18% Off
187 in stock
Description
Product Introduction：
Amaoe BGA Reballing Stencil For SAMSUNG Exynos 8895 MSM8998 S8 S8+ NOTE8 G9500 G955U N9500 CPU Chip BGA Stencil IC Solder Tin
Package:
1 x Rebaling Stencil Template
Additional information
| Type | Other |
|---|---|
| Model Number | Amaoe BGA Reballing Stencil |
| is_customized | No |
| Material | Stainless Steel |
| Usage | Commercial Manufacture |
| Thickness | 0.12MM |
3 reviews for Amaoe BGA Reballing Stencil For SAMSUNG Exynos 8895 MSM8998 S8 S8+ NOTE8 G9500 G955U N9500 CPU Chip BGA Stencil IC Solder Tin
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