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Home/Repair Tools/BGA Reballing Stencil/AMAOE BGA Reballing Stencil/Amaoe BGA reballing stencil For SAMSUNG S8 S8+ Note8 G9500 G955U N9500 MSM8998 Exynos 8895 CPU RAM WIFI Chip Tin Plant Net
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Amaoe BGA reballing stencil For SAMSUNG S8 S8+ Note8 G9500 G955U N9500 MSM8998 Exynos 8895 CPU RAM WIFI Chip Tin Plant Net

$7.70 $6.39

17% Off

199 in stock

Description

Product Introduction:

Amaoe BGA reballing stencil For SAMSUNG S8 S8+ Note8 G9500 G955U N9500 MSM8998 Exynos 8895 CPU RAM WIFI Chip Tin Plant Net

Package:

1 x Rebaling Stencil Template

Additional information

Type

Other

Model Number

Amaoe BGA Reballing Stencil

is_customized

No

Material

Stainless Steel

Usage

Commercial Manufacture

Thickness

0.12MM

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