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Home/Repair Tools/BGA Reballing Stencil/AMAOE BGA Reballing Stencil/Amaoe BGA Reballing Stencil For SAMSUNG S9/S9+ CPU RAM POWER WIFI AUDIO For Snapdragon 845 CPU PM845 Chip BGA IC Solder Tin
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(3 customer reviews)

Amaoe BGA Reballing Stencil For SAMSUNG S9/S9+ CPU RAM POWER WIFI AUDIO For Snapdragon 845 CPU PM845 Chip BGA IC Solder Tin

$8.57 $6.94

19% Off

191 in stock

Description

Product Introduction:

Amaoe BGA Reballing Stencil For SAMSUNG S9/S9+ CPU RAM POWER WIFI AUDIO For Snapdragon 845 CPU PM845 Chip BGA IC Solder Tin

Package:

1 x Rebaling Stencil Template

Additional information

Type

Other

Model Number

Amaoe BGA Reballing Stencil

is_customized

No

Material

Stainless Steel

Usage

Commercial Manufacture

Thickness

0.12MM

3 reviews for Amaoe BGA Reballing Stencil For SAMSUNG S9/S9+ CPU RAM POWER WIFI AUDIO For Snapdragon 845 CPU PM845 Chip BGA IC Solder Tin

  1. m***m

    хороший трафарет. быстрая доставка. рекомендую.

  2. E***s

  3. XiDiGi Shopper

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