WORLDWIDE
FREE SHIPPING
ONLINE SUPPORT
QUALITY GUARANTEE
Contact Us
Amaoe BGA Reballing Stencil For SAMSUNG S9/S9+ CPU RAM POWER WIFI AUDIO For Snapdragon 845 CPU PM845 Chip BGA IC Solder Tin
$6.86
18% Off
189 in stock
Description
Product Introduction：
Amaoe BGA Reballing Stencil For SAMSUNG S9/S9+ CPU RAM POWER WIFI AUDIO For Snapdragon 845 CPU PM845 Chip BGA IC Solder Tin
Package:
1 x Rebaling Stencil Template
Additional information
| Type | Other |
|---|---|
| Model Number | Amaoe BGA Reballing Stencil |
| is_customized | No |
| Material | Stainless Steel |
| Usage | Commercial Manufacture |
| Thickness | 0.12MM |
3 reviews for Amaoe BGA Reballing Stencil For SAMSUNG S9/S9+ CPU RAM POWER WIFI AUDIO For Snapdragon 845 CPU PM845 Chip BGA IC Solder Tin
Related products
Related products
Subscribe to our newsletter
Get the lastest discount news
Cell Phone Repair Parts and Accessories Online Store
m***m –
хороший трафарет. быстрая доставка. рекомендую.
E***s –
XiDiGi Shopper –