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Home/Repair Tools/BGA Reballing Stencil/AMAOE BGA Reballing Stencil/Amaoe BGA reballing stencil For XIAOMI 8 8SE MIX 2S Snapdragon 845 710 SDM845 SDM710 PM845 CPU POWER Chip BGA Chip Tin Plant Net
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Amaoe BGA reballing stencil For XIAOMI 8 8SE MIX 2S Snapdragon 845 710 SDM845 SDM710 PM845 CPU POWER Chip BGA Chip Tin Plant Net

$8.57 $6.94

19% Off

196 in stock

Description

Product Introduction:

Amaoe BGA reballing stencil For XIAOMI 8 8SE MIX 2S Snapdragon 845 710 SDM845 SDM710 PM845 CPU POWER Chip BGA Chip Tin Plant Net

Package:

1 x Rebaling Stencil Template

Additional information

Type

Other

Model Number

Amaoe BGA Reballing Stencil

is_customized

No

Material

Stainless Steel

Usage

Commercial Manufacture

Thickness

0.12MM

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