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Home/Repair Tools/BGA Reballing Stencil/AMAOE BGA Reballing Stencil/Amaoe BGA reballing stencil For XIAOMI NOTE3 6X REDMI NOTE5 NOTE 5 PRO Snapdragon 636 660 CPU POWER Chip BGA Chip Tin Plant Net
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(5 customer reviews)

Amaoe BGA reballing stencil For XIAOMI NOTE3 6X REDMI NOTE5 NOTE 5 PRO Snapdragon 636 660 CPU POWER Chip BGA Chip Tin Plant Net

$7.70 $6.39

17% Off

180 in stock

Description

Product Introduction:

Amaoe BGA reballing stencil For XIAOMI NOTE3 6X REDMI NOTE5 NOTE 5 PRO Snapdragon 636 660 CPU POWER Chip BGA Chip Tin Plant Net

Package:

1 x Rebaling Stencil Template

Additional information

Type

Other

Model Number

Amaoe BGA Reballing Stencil

is_customized

No

Material

Stainless Steel

Usage

Commercial Manufacture

Thickness

0.12MM

5 reviews for Amaoe BGA reballing stencil For XIAOMI NOTE3 6X REDMI NOTE5 NOTE 5 PRO Snapdragon 636 660 CPU POWER Chip BGA Chip Tin Plant Net

  1. D***o

  2. a***v

  3. I***k

    О’кей получил товар

  4. B***r

  5. R***z

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