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Amaoe BGA Reballing Stencil Solder Tin For SAMSUNG S7/S7+ G9300/G9350/G930F Exynos 8890/MSM8996 CPU RAM WIFI POWER Chip
$6.86
18% Off
166 in stock

Description
Product Introduction:
Amaoe BGA Reballing Stencil Solder Tin For SAMSUNG S7/S7+ G9300/G9350/G930F Exynos 8890/MSM8996 CPU RAM WIFI POWER Chip
Package:
1 x Rebaling Stencil Template
Additional information
Type | Other |
---|---|
Model Number | Amaoe BGA Reballing Stencil |
is_customized | No |
Material | Stainless Steel |
Usage | Commercial Manufacture |
Thickness | 0.12MM |
7 reviews for Amaoe BGA Reballing Stencil Solder Tin For SAMSUNG S7/S7+ G9300/G9350/G930F Exynos 8890/MSM8996 CPU RAM WIFI POWER Chip
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спасибо продавцу за товар. все пришло в целом виде. упаковал отлично, спасибо.