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Home/Repair Tools/BGA Reballing Stencil/AMAOE BGA Reballing Stencil/Amaoe BGA Reballing Stencil Solder Tin For SAMSUNG S7/S7+ G9300/G9350/G930F Exynos 8890/MSM8996 CPU RAM WIFI POWER Chip
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(7 customer reviews)

Amaoe BGA Reballing Stencil Solder Tin For SAMSUNG S7/S7+ G9300/G9350/G930F Exynos 8890/MSM8996 CPU RAM WIFI POWER Chip

$7.70 $6.32

18% Off

169 in stock

Description

Product Introduction:

Amaoe BGA Reballing Stencil Solder Tin For SAMSUNG S7/S7+ G9300/G9350/G930F Exynos 8890/MSM8996 CPU RAM WIFI POWER Chip

Package:

1 x Rebaling Stencil Template

Additional information

Type

Other

Model Number

Amaoe BGA Reballing Stencil

is_customized

No

Material

Stainless Steel

Usage

Commercial Manufacture

Thickness

0.12MM

7 reviews for Amaoe BGA Reballing Stencil Solder Tin For SAMSUNG S7/S7+ G9300/G9350/G930F Exynos 8890/MSM8996 CPU RAM WIFI POWER Chip

  1. J***o

  2. A***a

  3. v***o

  4. XiDiGi Shopper

  5. p***A

  6. A***v

  7. O***v

    спасибо продавцу за товар. все пришло в целом виде. упаковал отлично, спасибо.

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