55x35cm/24X22cm Heat Insulation Silicone Pad Desk Mat Maintenance Platform For Mobile phone BGA Soldering Repair
Type: Heat insulation pad
Net weight: 648 g
Thickness: about 5 mm
Heat resistance: 500 °C
Material: Environmentally friendly organosilicone
Resistance to high temperature of 500 °C.
Sevaral hole locations for setting screws, IC chips and small parts.
Built-in scale ruler (0 ~ 36 cm ) on bottom section.
Make your repair work easy.
A good partner for hot air gun.
Only some small section is magnetic (marked on the pad), and can be used to hold screws firmly.
It is a bit weak, NOT so strong magneti
1 PC * Heat Insulation pad