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Wylie BGA Reballing Stencil for HI1102 MT6158A MT6169V MT6328V MT6320 MT6165V MT6333P Power WiFi IC Chip
$8.83
18% Off
195 in stock
Description
Product Introduction：
Wylie BGA Reballing Stencil for HI1102 MT6158A MT6169V MT6328V MT6320 MT6165V MT6333P Power WiFi IC Chip
Package:
1 x Wylie Stencil Template
Additional information
| Type | Other |
|---|---|
| Model Number | Wylie BGA Reballing Stencil |
| is_customized | No |
| Material | Stainless Steel |
| Usage | Commercial Manufacture |
| Thickness | 0.12MM |
3 reviews for Wylie BGA Reballing Stencil for HI1102 MT6158A MT6169V MT6328V MT6320 MT6165V MT6333P Power WiFi IC Chip
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