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Home/Repair Tools/BGA Reballing Stencil/WYLIE BGA Reballing Stencil/Wylie BGA Reballing Stencil for HI6363 HI6423 HI1102 HI6523 HI3670 HI6421 Kirin 970 P20 Mate 10 Power PM CPU RAM Charing IC Chip
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Wylie BGA Reballing Stencil for HI6363 HI6423 HI1102 HI6523 HI3670 HI6421 Kirin 970 P20 Mate 10 Power PM CPU RAM Charing IC Chip

$8.77 $7.28

17% Off

197 in stock

Description

Product Introduction:

Wylie BGA Reballing Stencil for HI6363 HI6423 HI1102 HI6523 HI3670 HI6421 Kirin 970 P20 Mate 10 Power PM CPU RAM Charing IC Chip

Package:

1 x Wylie Stencil Template

Additional information

Type

Other

Model Number

Wylie BGA Reballing Stencil

is_customized

No

Material

Stainless Steel

Usage

Commercial Manufacture

Thickness

0.12MM

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