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Wylie BGA Reballing Stencil for HI6363 HI6423 HI1102 HI6523 HI3670 HI6421 Kirin 970 P20 Mate 10 Power PM CPU RAM Charing IC Chip
$8.83
18% Off
197 in stock
Description
Product Introduction：
Wylie BGA Reballing Stencil for HI6363 HI6423 HI1102 HI6523 HI3670 HI6421 Kirin 970 P20 Mate 10 Power PM CPU RAM Charing IC Chip
Package:
1 x Wylie Stencil Template
Additional information
| Type | Other |
|---|---|
| Model Number | Wylie BGA Reballing Stencil |
| is_customized | No |
| Material | Stainless Steel |
| Usage | Commercial Manufacture |
| Thickness | 0.12MM |
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