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Home/Repair Tools/BGA Reballing Stencil/WYLIE BGA Reballing Stencil/Wylie BGA Reballing Stencil for Huawei CPU NAND Power IC Chip MSM8916 MSM8940 MSM8953 1AB MSM8952 MSM8937 MSM8953 B01 BGA221
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(1 customer review)

Wylie BGA Reballing Stencil for Huawei CPU NAND Power IC Chip MSM8916 MSM8940 MSM8953 1AB MSM8952 MSM8937 MSM8953 B01 BGA221

$11.37 $9.21

19% Off

197 in stock

Description

Product Introduction:

Wylie BGA Reballing Stencil for Huawei CPU NAND Power IC Chip MSM8916 MSM8940 MSM8953 1AB MSM8952 MSM8937 MSM8953 B01 BGA221

Package:

1 x Wylie Stencil Template

Additional information

Type

Other

Model Number

Wylie BGA Reballing Stencil

is_customized

No

Material

Stainless Steel

Usage

Commercial Manufacture

Thickness

0.12MM

1 review for Wylie BGA Reballing Stencil for Huawei CPU NAND Power IC Chip MSM8916 MSM8940 MSM8953 1AB MSM8952 MSM8937 MSM8953 B01 BGA221

  1. E***s

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