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Wylie BGA Reballing Stencil for Huawei CPU NAND Power IC Chip MSM8916 MSM8940 MSM8953 1AB MSM8952 MSM8937 MSM8953 B01 BGA221
$8.83
18% Off
197 in stock
Description
Product Introduction：
Wylie BGA Reballing Stencil for Huawei CPU NAND Power IC Chip MSM8916 MSM8940 MSM8953 1AB MSM8952 MSM8937 MSM8953 B01 BGA221
Package:
1 x Wylie Stencil Template
Additional information
| Type | Other |
|---|---|
| Model Number | Wylie BGA Reballing Stencil |
| is_customized | No |
| Material | Stainless Steel |
| Usage | Commercial Manufacture |
| Thickness | 0.12MM |
1 review for Wylie BGA Reballing Stencil for Huawei CPU NAND Power IC Chip MSM8916 MSM8940 MSM8953 1AB MSM8952 MSM8937 MSM8953 B01 BGA221
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