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Wylie BGA Reballing Stencil for Huawei CPU NAND Power IC Chip MSM8916 MSM8940 MSM8953 1AB MSM8952 MSM8937 MSM8953 B01 BGA221
$8.83
18% Off
197 in stock

Description
Product Introduction:
Wylie BGA Reballing Stencil for Huawei CPU NAND Power IC Chip MSM8916 MSM8940 MSM8953 1AB MSM8952 MSM8937 MSM8953 B01 BGA221
Package:
1 x Wylie Stencil Template
Additional information
Type | Other |
---|---|
Model Number | Wylie BGA Reballing Stencil |
is_customized | No |
Material | Stainless Steel |
Usage | Commercial Manufacture |
Thickness | 0.12MM |
1 review for Wylie BGA Reballing Stencil for Huawei CPU NAND Power IC Chip MSM8916 MSM8940 MSM8953 1AB MSM8952 MSM8937 MSM8953 B01 BGA221
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