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Home/Repair Tools/BGA Reballing Stencil/WYLIE BGA Reballing Stencil/Wylie BGA Reballing Stencil for Huawei samsung CPU RAM IC Chip MSM8998 MSM8996 MSM8992 MSM8956 MSM8976
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Wylie BGA Reballing Stencil for Huawei samsung CPU RAM IC Chip MSM8998 MSM8996 MSM8992 MSM8956 MSM8976

$11.37 $9.21

19% Off

196 in stock

Description

Product Introduction:

Wylie BGA Reballing Stencil for Huawei samsung CPU RAM IC Chip MSM8998 MSM8996 MSM8992 MSM8956 MSM8976

Package:

1 x Wylie Stencil Template

Additional information

Type

Other

Model Number

Wylie BGA Reballing Stencil

is_customized

No

Material

Stainless Steel

Usage

Commercial Manufacture

Thickness

0.12MM

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