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Home/Repair Tools/BGA Reballing Stencil/WYLIE BGA Reballing Stencil/Wylie BGA Reballing Stencil FOR MSM8940 MSM8939 MSM8909 MSM8998 CPU MEMORY SDM660 MT6797W MT6595 MT6750
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Wylie BGA Reballing Stencil FOR MSM8940 MSM8939 MSM8909 MSM8998 CPU MEMORY SDM660 MT6797W MT6595 MT6750

$8.83

18% Off

198 in stock

Description

Product Introduction:

Wylie BGA Reballing Stencil FOR MSM8940 MSM8939 MSM8909 MSM8998 CPU MEMORY SDM660 MT6797W MT6595 MT6750

Package:

1 x Wylie Stencil Template

Additional information

Type

Other

Model Number

Wylie BGA Reballing Stencil

is_customized

No

Material

Stainless Steel

Usage

Commercial Manufacture

Thickness

0.12MM

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