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Home/Repair Tools/BGA Reballing Stencil/WYLIE BGA Reballing Stencil/Wylie BGA Reballing Stencil for SDM450 SDM660 MT6771V MT6757V SDM710 MT6763V MT6739V MT6762V CPU IC Chip
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(3 customer reviews)

Wylie BGA Reballing Stencil for SDM450 SDM660 MT6771V MT6757V SDM710 MT6763V MT6739V MT6762V CPU IC Chip

$8.41 $6.99

17% Off

186 in stock

Description

Product Introduction:

Wylie BGA Reballing Stencil for SDM450 SDM660 MT6771V MT6757V SDM710 MT6763V MT6739V MT6762V CPU IC Chip

Package:

1 x Wylie Stencil Template

Additional information

Type

Other

Model Number

Wylie BGA Reballing Stencil

is_customized

No

Material

Stainless Steel

Usage

Commercial Manufacture

Thickness

0.12MM

3 reviews for Wylie BGA Reballing Stencil for SDM450 SDM660 MT6771V MT6757V SDM710 MT6763V MT6739V MT6762V CPU IC Chip

  1. A***a

  2. E***i

    ok

  3. E***s

    llegaron antes de la fecha prevista, vendedor despachó rápido. recomendado vamos a probar su calidad.

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