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Home/Repair Tools/BGA Reballing Stencil/WYLIE BGA Reballing Stencil/Wylie BGA Reballing Stencil for SDM845 PM845 SDR845 WCN9341 HI6363 PM670 PM670A/L HI6421 BCM43596 HI6423 WCD9335 Power PM IC
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Wylie BGA Reballing Stencil for SDM845 PM845 SDR845 WCN9341 HI6363 PM670 PM670A/L HI6421 BCM43596 HI6423 WCD9335 Power PM IC

$11.37 $9.21

19% Off

199 in stock

Description

Product Introduction:

Wylie BGA Reballing Stencil for SDM845 PM845 SDR845 WCN9341 HI6363 PM670 PM670A/L HI6421 BCM43596 HI6423 WCD9335 Power PM IC

Package:

1 x Wylie Stencil Template

Additional information

Type

Other

Model Number

Wylie BGA Reballing Stencil

is_customized

No

Material

Stainless Steel

Usage

Commercial Manufacture

Thickness

0.12MM

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