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Wylie BGA Reballing Stencil for SDM845 PM845 SDR845 WCN9341 HI6363 PM670 PM670A/L HI6421 BCM43596 HI6423 WCD9335 Power PM IC
$8.83
18% Off
198 in stock
Description
Product Introduction：
Wylie BGA Reballing Stencil for SDM845 PM845 SDR845 WCN9341 HI6363 PM670 PM670A/L HI6421 BCM43596 HI6423 WCD9335 Power PM IC
Package:
1 x Wylie Stencil Template
Additional information
| Type | Other |
|---|---|
| Model Number | Wylie BGA Reballing Stencil |
| is_customized | No |
| Material | Stainless Steel |
| Usage | Commercial Manufacture |
| Thickness | 0.12MM |
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