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Wylie BGA Reballing Stencil for SDM845 PM845 SDR845 WCN9341 HI6363 PM670 PM670A/L HI6421 BCM43596 HI6423 WCD9335 Power PM IC
$8.83
18% Off
198 in stock

Description
Product Introduction:
Wylie BGA Reballing Stencil for SDM845 PM845 SDR845 WCN9341 HI6363 PM670 PM670A/L HI6421 BCM43596 HI6423 WCD9335 Power PM IC
Package:
1 x Wylie Stencil Template
Additional information
Type | Other |
---|---|
Model Number | Wylie BGA Reballing Stencil |
is_customized | No |
Material | Stainless Steel |
Usage | Commercial Manufacture |
Thickness | 0.12MM |
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