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Wylie BGA Reballing Stencil for vivo X6 X7 X9 oppo R9P R9S Plus CPU RAM WIFI Power NAND IC PMI8952 BQ24296M WCN3615
$8.83
18% Off
199 in stock
Description
Product Introduction：
Wylie BGA Reballing Stencil for vivo X6 X7 X9 oppo R9P R9S Plus CPU RAM WIFI Power NAND IC PMI8952 BQ24296M WCN3615
Package:
1 x Wylie Stencil Template
Additional information
| Type | Other |
|---|---|
| Model Number | Wylie BGA Reballing Stencil |
| is_customized | No |
| Material | Stainless Steel |
| Usage | Commercial Manufacture |
| Thickness | 0.12MM |
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