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Wylie BGA Reballing Stencil for vivo X6 X7 X9 oppo R9P R9S Plus CPU RAM WIFI Power NAND IC PMI8952 BQ24296M WCN3615
$8.83
18% Off
199 in stock

Description
Product Introduction:
Wylie BGA Reballing Stencil for vivo X6 X7 X9 oppo R9P R9S Plus CPU RAM WIFI Power NAND IC PMI8952 BQ24296M WCN3615
Package:
1 x Wylie Stencil Template
Additional information
Type | Other |
---|---|
Model Number | Wylie BGA Reballing Stencil |
is_customized | No |
Material | Stainless Steel |
Usage | Commercial Manufacture |
Thickness | 0.12MM |
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